Wir sind in diesen Ländern Ihr
Partner für Produkte von Dow (PCB): AT, HU, RO,
BG, SI, HR, SR, BH, MK, GR
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Technology and materials for printed circuit
manufacturing
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Dow provides technology, materials
and fabrication services in metallization, imaging and
optoelectronics to printed circuit board manufacturers
for powerful, multilayered circuit boards in computers,
cell phones, automobiles and many other electronic
devices. |
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Neutralizer,
Permanganate etch, Solvent swell
Dow provides a range of
chemistry for smear removal and adhesion
promotion for today's printed circuit materials.
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Develop etch strip/tin
strip |
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Developer, Etchant
additive, Resist stripper, Tin stripper
Meeting the most rugged
standards in outerlayer processing is a crucial
part of the Dow photo-imaging product line
including developers, etchant additives, resist
and tin strippers.
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Conductron, Crimson,
Graphite
Dow offers conductive
processes, including vertical or horizontal,
low- or high-build, direct plate or electroless
copper processes.
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Accelerator, Catalyst,
Conditioner, Metallization, Microetch
Dow’s Making Holes
Conductive processes offer vertical or
horizontal, low-build or high-build, direct
plate or electroless copper processes. |
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Cleaners,
Electrolytic Copper DC, Electrolytic Copper PPR
Electrolytic tin, Electrolytic tin lead,
Microetches
Electrolytic copper plating
creates the conductive pathways within printed
circuit boards. Dow provides a number of options
to suit user requirements, whether DC or pulse
rectification, horizontal or vertical equipment,
or panel or pattern plate. These processes are
available to meet the needs of the thinnest or
thickest boards, mixed technology HDI boards, or
dense chip packaging substrates. |
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Autocatalytic silver,
Electroless nickel, Electroless palladium,
Electrolytic gold
ENIG preplate, Immersion gold, Immersion tin
The selection of final
finish for a printed circuit board is an
important part of ensuring high yield during
component assembly and the reliability of the
assembled board during the lifetime of the
electronic device. Dow has a range of final
finish processes to meet the evolving
requirements of the component, assembly and end
user. |
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Copper oxide, Oxide
replacement
Surface modification of
copper is required to achieve reliable bond
strengths in multilayer printed circuits. Dow
provides conventional and reduced-oxide
processes as well as oxide-replacement processes. |
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Photoresist
Dow offers a range of liquid
and dry photoresist products for all
circuit-board patterning, photochemical
machining and microelectronics packaging
applications. |
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Ihre Ansprechpartner für
Dow Produkte (Leiterplatte):
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Service & Technik |
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