CV-300T
Manufacturer
Nikko-MaterialsCV-300T is down-sized model of CV-300, which is specially designed for wafer and Small substrate. It is also capable of conveying extremely thin wafer with dicing frame.
Equipment Structure:
- Carrier Film Conveyance System(Film Forwarder/ Film Rewinder)
- Lamination Chamber
- Lamination Method(Diaphragm)
Lamination Method: Diaphragm
Footprint: (L)3717mm x (w) 2530mm x (h)2120mm
Acceptable Worksize: MAX350 x 350(mm)
Utilities:
- Compressed Air: 0.5~0.6MPa
- Forced Exhaust
- 3-Phase AC 220V
- Cooling water for Vacuum Pump: 2~3L/min