CV-300T is down-sized model of CV-300, which is specially designed for wafer and Small substrate. It is also capable of conveying extremely thin wafer with dicing frame.

Equipment Structure:

  • Carrier Film Conveyance System(Film Forwarder/ Film Rewinder)
  • Lamination Chamber
  • Lamination Method(Diaphragm)

Lamination Method: Diaphragm

Footprint: (L)3717mm x (w) 2530mm x (h)2120mm

Acceptable Worksize: MAX350 x 350(mm)


  • Compressed Air: 0.5~0.6MPa
  • Forced Exhaust
  • 3-Phase AC 220V
  • Cooling water for Vacuum Pump: 2~3L/min

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