EDI-series
Manufacturer
ORC
Application use:
Solder resist formation:
- FC-BGA substrates/FC-CSP substrates
- Various module substrates such as AiP
- HDI substrates
Exposure of various other sensitive materials
- Photovia, coverlay, etc.
Features:
- Realizes resist SRO of φ40µm to accommodate miniaturization of package substrates. (EDi-5308)
- New UV lamp light source with greatly improved light intensity achieves up to 10% higher productivity than conventional models. (EDi-8308)
- The broadband wavelength of the UV lamp light source enables the use of a wide range of photo sensitive materials.
- High positional accuracy of 6 µm is achieved with the D-A-T high-precision compensation technology and a new high-precision stage (EDi-5308).
- Die by Die alignment function solves the die shift problem of FO-PLP (optional function)
- Supports large substrates up to 25 “X32” (EDi-8310)