Exa-Ms5
Manufacturer
ORC
Application Use:
- Package Substrate Insulation Via Formation.
- Circuit formation by trenching.
Features:
- High microfabrication performance, capable of Φ5μm vias.
- Various shapes, including large and small vias and rectangles, can be simultaneously handled by mask design.
- Productivity is constant regardless of the number of vias, and the units can handle future increases in the number of vias.
- Bump pitch of 40µm or less is possible due to its fine via processing performance and high-precision alignment performance.