EXOS 10/26 (Vacuum Reflow)


With the EXOS 10/26, Ersa presents a convection reflow soldering system with 22 heating and four cooling zones as well as a vacuum chamber after the peak zone, with which the void rate can be reduced by 99%. This is achieved by relying on technologies proven thousands of times in HOTFLOW models, such as heating and cooling zones or the intuitive, award-winning interface.

Thanks to intelligent features, the Ersa reflow soldering system produces particularly economically and void-free. In addition to process reliability, the EXOS is particularly easy to maintain. For energy-efficient cooling, three expansion stages are available for the EXOS (a maximum of four cooling zones at the top and bottom), so that optimum cooling gradients can be set for all requirements.

How to avoid Voids? Ersa EXOS 10/26!

A challenge for SMD solder joints is voids reducing the solder joint quality. They may even lead to component failure. The void rate can be reduced by applying a vacuum as soon as the solder becomes liquid. By striving for pressure compensation, the voids migrate into the area of the negative pressure, thus leaving the solder joints.

Highlights EXOS 10/26

  • 4-part conveyor (infeed, preheating and peak, vacuum, cooling zone) also as dual track
  • Perfect synchronization of the assemblies and transitions thanks to sensor-monitored conveyor, no external infeed module required
  • Maintenance-friendly and lubricant-free roller conveyor in the vacuum module
  • Optimum access to the vacuum chamber through lifting unit from above
  • Optimum temperature profiles through medium-wave emitters in the vacuum module
  • Maximum machine availability thanks to fast removal of the conveyor unit in the vacuum module
  • Part-integrated vacuum pump on separate module carrier for easy and fast maintenance
  • Innovative cleaning system SMART ELEMENTS®

Options

  • Four-part transport system
  • Center support
  • Double track transport
  • Medium wave radiant heaters in the vacuum module
  • SMART Elements® Process Cleaning
  • Basic Cooling Plus
  • Power cooling
  • N2 equipment with O2 analyzer
  • SMEMA interface
  • HERMES interface

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