FDi-series
Manufacturer
ORC
Applications: Patterning for high-resolution package PCB
- FC-BGA Substrates
- FC-CSP substrates
- Various module substrates such as AiP
Features
- -Direct exposure of circuit patterns of 10 µm or less
- -ORC’s unique alignment compensation technology enables high-precision pattern alignment
- -The ability to switch between productivity-oriented and resolution-oriented exposure modes allows for product development and mass production with a focus on current and future mass production.
- -Expanded lineup of application-specific products based on FDi-MP