HOTFLOW 4/14


The Ersa HOTFLOW 4/14 – reflow soldering system with outstanding thermal performance and an excellent power balance

The Ersa HOTFLOW 4/14 Reflow Soldering System is of robust design and manufactured entirely from steel, welded air-tight, powder coated and with interior electric cabinet and a PC operating terminal. Features include the motorized hood opening, quick-change convection heater cassettes, multi-level process gas cleaning and a powerful, high-performance cooling zone.

Highlights Reflow System Ersa HOTFLOW 4/14

  • Reflow soldering system with outstanding thermal performance and an excellent power balance
  • Individually controllable process zones via energy-optimized motors
  • Multi-level controlled cooling
  • Multi-level process gas cleaning with pyrolysis
  • Rest-oxygen monitoring and control, low N2 consumption
  • Ersa Process Control software (EPC)
  • Software to generate temperature profiles
  • Multi-track conveyor systems (1-4), 1x fixed, 3x variable
  • Thermally invisible center supports
  • Low energy consumption in continuous operation
  • Patented grip conveyor system for flex boards
  • Auto Profiler to off-line and quickly generate temperature profiles

Options

  • Pin-and-chain conveyor with either 3 / 4 / 5 mm pin length
  • Pin-and-chain conveyor with low-mass center support
  • Motorized adjustment of conveyor width and center support
  • Up to 4 tracks with center support in the system (1x fixed, 3x variable)
  • Patented grip conveyor system for flex boards
  • With single track systems, the use of low mass tubular supports is possible
  • Operation with either ambient air or nitrogen
  • The cooling zone of the system can be equipped with an integrated cooling system and an external cooling aggregate
  • Cooling can be either with cooling aggregate or with local water connection
  • Multi-level condensation management system available with pyrolysis
  • Heating and cooling cassettes removable without tools
  • Energy-consumption management

Request information material by e-mail