In-line Plasma Desmear


  • By employing MF power and unique ICP (Inductively Coupling Plasma) plasma design, high density plasma can be induced.
  • Water-cooling Electrode design can remain the consistency of electrodes resistances and thus increases the process stability.
  • Multiple gases selectivity or Mixing gases can be used.
  • Single Chamber or Dual Chamber with In-line Automation Design.
  • One Panel will be treated in each chamber. The cleaning/etching effect and uniformity will be much increased.

Performance characteristics

  • PCB/FPC/Rigid-Flex Board.
  • Substrate cleaning before shipping.
  • Smear removal for through hole and blind via after laser drilling .
  • Surface cleaning before Cu layer plating.
  • Surface activation and roughness improvement.
  • Drilling function to replace laser driller.

Applications

  • 100% In-line process can reduce human power and achieve production automation.
  • One Panel will be treated in each chamber. The cleaning/etching effect and uniformity will be much increased.
  • PC based software design dependent on customer’s requirements.
  • Shop Floor System or SECS/GEM Automation can be employed for the in-line requirements.
  • Fully In-line process can reduce the risk to cause damages on the panel.

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