Inline Vertical Curing Oven
Manufacturer
VanstronVanstron’s Vertical Curing Oven is an innovative, space-saving solution designed for high-performance PCB curing in SMT production lines. With its compact vertical design, this advanced system delivers exceptional curing efficiency for adhesives, coatings, and encapsulants, ensuring consistent quality and superior thermal performance.
Application
- PCB Curing: Adhesives, solder mask, conformal coating, and other thermal processes.
- SMT Assembly: Seamless integration into automated production lines.
- Electronics Manufacturing: Suitable for a wide range of components and substrates.
Key Features
- Space-Saving Vertical Design: Maximizes factory floor space while maintaining high throughput.
- Precision Temperature Control: Ensures uniform curing across all PCBs.
- Multi-Layer Configuration: Supports simultaneous processing of multiple PCBs for enhanced productivity.
- Energy Efficiency: Reduces power consumption without compromising performance.
- CE-Certified Reliability: Meets international safety and quality standards.
- Customizable Settings: Adjustable curing time, temperature, and process parameters to suit specific production requirements.