iX7059 PCB (XL)
Manufacturer
Viscom
3D X-ray inspection for high-density and double-sided PCB assemblies at the highest level
With its iX7059 product line, Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards. Outstanding inspection performance for SMD and THT solder joints as well as exact measurement of voids deliver 100% quality assurance in modern SMT production, so that concealed defects can be detected even when complex assemblies are subject to severe shadowing. In addition to traditional SMD inspection, the compact iX7059 PCB (XL) 3D AXI system also provides high-precision, reliable inspection of soldering defects such as head-in-pillow and pores in BGA and LGA components. Cutting-edge, powerful microfocus X-ray technology, new dynamic 3D image acquisition methods and seamless handling guarantee the best throughput rates. The iX7059 PCB Inspection XL with extended longboard option comes into play for especially large PCB assemblies measuring up to 1,600 mm – this solution is ideal for server boards, LEDs, semiconductor and 5G electronics.
Advantages
- Optimal FPY results in SMT production
- Future-ready 3D inline X-ray with CT
- Inspection even for large PCB assemblies
- Best defect coverage
- Space-saving system design
- Extremely simple programming