MMS-series


Application use:

  • Solder resist Imaging/circuit patterning on various substrates (HDI boards, flexible boards, module boards, etc).
  • Development of various materials, prototyping, etc.

Features:

  • Broadband wavelengths enable the use of a wide variety of solder resists, such as white and black.
  • Supports a wide range of needs, from small-lot, multi-variety prototyping and production to mass production with retrofitting to conveyor systems.
  • Optical head configuration can be proposed according to substrate size and budget.
  • Large-format models are also available.

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