NEMST-DS2002
Manufacturer
NEMS Tech.Features/Performances
- CP plasma design
- Reaction gas: Ar, Ar+O2
- Energy concentration and good results.
- The processing pitch (from the sample) is high.
- If it is not damaged, no need to replace the electrode
- Can be single or online modular
- Direct plasma
- Can be applied to various materials and materials of various shapes
- The reaction gas consumption is small.
- Effective width of plasma: 6mm~10mm
- Processing speed: 10mm/sec~100mm/sec
- Processing pitch (from sample): 5mm~10mm
- Can be applied to various materials and materials of various shapes
- High plasma stability and uniformity
Applications
- Clean the ITO Finger in the LCM.
- Surface cleaning and upgrading of various components and materials.
- Wafer to photoresist process.
- Various materials lamination or pre-coating process.