S3088 DT

  • Technology – High throughput, peak performance camera technology
  • Inspection depth – 2D / 2.5D and 3D inspection with up to 8 angled views
  • Variant diversity – SPI, AOI, CCI and UFI camera configuration options
  • Versatility – Double or single track systems possible
  • Networking – Complete connection to cutting-edge Industry 4.0 interfaces
  • Footprint – Integrated monitor for reduced system dimensions


  • Maximum inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro/vVision-ready
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Lead-free technology fully supported
  • Tried and tested comprehensive IPC-compliant Viscom inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included


  • Individually configurable high performance optical camera technology (SPI, AOI, CCI, UFI)
  • Connection to horizontal interfaces along the production line
    • Viscom Quality Uplink – Intelligent networking of Viscom inspection systems along the production line
    • Viscom Closed Loop – Intelligent communication of Viscom inspection systems with paste printers and placement machines
    • Production line control and product traceability
    • Flexible integration of additional production-relevant modules: buffers, label printers, etc.
  • Connection to vertical interfaces for communication with MES systems
  • Flexible single- or multi-line verification solutions
  • Statistical process control Viscom SPC / vSPC
  • Offline programming stations for increased efficiency

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