S3088 ultra chrome SPI

Excellent 3D solder paste inspection system with advanced camera technology

Viscom’s compact SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D features, such as volume, height, and shape as well as surface area, displacement, and smearing are accurately recorded. The 3D inline system demonstrates our decades of experience in reliable, high throughput solder paste inspection systems. The latest sensor technology with an orthogonal camera and four lateral views results in the highest inspection quality. Realistic color images ensure quick and clear verification. The FastFlow handling guarantees an extremely high throughput thanks to synchronous in- and outfeed of the assemblies. The system can achieve handling times of up to 2.5 seconds with minimal mechanical impact loads. Intelligent networking in the SMT line enhances your process stability and efficiency.


  • 100% defect identification for ultimate reliability
  • Cutting-edge, calibration-free 3D camera technology
  • Improved inspection speed
  • Module change in up to 2.5 seconds
  • End-to-end process analysis with Viscom Quality Uplink
  • Closed loop enhances quality and efficiency
  • Integrated verification

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