S3088 ultra/ultra gold


Very reliable high-speed 3D inspection for soldered Connections

  • Extremely fast AOI camera system
  • Scalable, modular camera technology with 3D measuring function
  • Greatest inspection depth: reliable inspection of 03015 und fine-pitch components
  • Maximum fault coverage – 9 views plus 3D measurement
  • Best resolution at angled views
  • Height measurement of components
  • Extremely high throughput due to FastFlow Handling
  • Revolutionary simplicity in AOI operation with vVision
  • Fast program generation with vVision/EasyPro
  • Reading DataMatrix code, bottom up

Viscom Plus

  • Reliable inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Inspection in the shortest cycle time
  • Lead-free technology fully supported
  • Successful comprehensive IPC-conformant inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Viscom Quality Uplink for optimization of the entire process
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • 30 years of AOI experience included

Options

  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Preparation, storage, and printing of error logs
  • Automated grayscale value calibration for constant inspection results
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing better verification

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