The long-term inspection solution for wave, reflow, pre-reflow and selective soldering

  • Extremely fast AOI XM 3D camera system
  • Scalable, modular high performance camera technology with 3D measuring function
  • Maximum inspection depth: 03015 components
  • Best resolution at angled views
  • Height measurement of components
  • Single- or double-track operation
  • Also supports larger printed circuit boards
  • Fast program generation with vVision/EasyPro

Viscom Plus

  • Maximum inspection program optimization through integrated verification
  • Robust short-cycle inspections
  • Global libraries, global calibration: Transferability to all systems
  • Simple, fast operation and inspection program generation with EasyPro/vVision-ready
  • Traceability, SPC, verification, off-line programming, and much more
  • Lead-free technology fully supported
  • Tried and tested comprehensive IPC-compliant Viscom inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • 30 years of AOI experience included



  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Label printers and bad board markers control
  • Intelligent FIFO buffer control
  • Automated grayscale value calibration to ensure consistent inspection results
  • Preparation, storage and printing of error logs
  • Flexible single- and multi-line utilization of the classification station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing a better verification
  • XM ultra high-speed camera technology

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