Soldering paste
Manufacturer
InterfluxNO-CLEAN SOLDER PASTES
LMPA™-Q6
- Enhanced low melting point solder paste
- High stability on the stencil
- Absolutely halide-free
- Smooth, clear and transparent residue
- Low voiding
- Reduced cost of production.
- Increased mechanical reliability
Interflux® LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
LP 5720
- High stability on the stencil
- Absolutely halide-free
- For SnPb(Ag) alloys
- For lead-free alloys
- Transparent post reflow residue
Interflux® LP 5720 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.
DP 5600
- For reflow soldering
- For stencil printing
- For dispensing
- Absolutely halide-free
- Low melting temperature
- Low voiding
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
DP 5505
- For reflow soldering
- For stencil printing
- For dispensing
- Absolutely halide-free
- Lead-free alloys
- SnPb alloys
Interflux® DP 5505 is our general purpose, high stability, no-clean solder paste in SnPb(Ag) and lead-free alloys.
µ-DIFE 7
- For reflow soldering
- For rework & repair
- For dipping
- Absolutely halide-free
Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.
IF 9009LT
- For reflow soldering
- For stencil printing
- For dispensing
- Lead-free alloys
- SnPb alloys
- Increased activity
Interflux® IF 9009LT is a no-clean solder paste with increased activity in SnPb(Ag) and lead-free alloys.