For many years, the Ersa VERSAFLOW 3 series has been the number 1 in inline selective soldering. Around the globe, the most renowned companies trust in the successful Ersa selective soldering series and manufacture thousands of electronic assemblies every day, extremely profitably and in top quality.

This success is based on the modular design of the VERSAFLOW 3 platform, which can be configured in an almost unlimited number of different combinations and thus always provides the right solution for the customer. On the other hand, Ersa offers leading selective soldering technology, combined with the highest process know-how and a unique and outstanding worldwide sales and service network.

The VERSAFLOW 3/66 XL was developed to complete the portfolio: Really big boards are the job of the VERSAFLOW 3/66 XL. The large boards with a length of up to 3,000 mm are the métier of the system, which is thus equipped for the technologies of today and tomorrow – for example for the electronics used in 5G or radio antennas.


  • High-end selective soldering system to integrate into in-line manufacturing concepts
  • Maximum PCB size: 3,000 x 610 mm
  • Parallel process through separation of fluxing, preheating and soldering
  • Proven dual solder pot system to reduce the cycle time or to use two different nozzles/alloys
  • Flexible system configuration due to modular machine design
  • Ideal for linking to manual workstations or peripheral equipment
  • Secure process control with monitoring of all relevant parameters
  • CAD-Assistant for offline programming
  • Link for traceability systems for process control


  • Dual solder pot, available as Y- or X- variable
  • Roller conveyors for direct board handling
  • Programmable conveyor width adjustment
  • Precision Drop-Jet Fluxer, up to 2 spray heads
  • Maximum permissible PCB weight: 20 kg
  • 2 different flux media for each module
  • IR preheater individually configurable, top- and bottom-side convection heaters
  • Pyrometer temperature monitoring
  • Solder module with 2 solder pots for mini-wave and mini-dip applications
  • Transfer of board data from the CAD system

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