X7056-II
Manufacturer
Viscom
X7056-II
An Innovative Inline X-ray system
Ultra-fast Handling meets Outstanding Image Quality
The X7056-II’s state-of-the-art X-ray technology ensures precise inspection of high-end electronics. The inline X-ray system has won five international awards for its extremely high throughput and outstanding image quality. Even concealed solder joints and components are displayed as crystal-clear slice images to guarantee seamless quality control. The option to also integrate AOI inspection within the system and to perform combined inspections is a special feature of the X7056-II – an efficient, space-saving highlight that provides fast and comprehensive inspection results.
- Revolutionary handling concept xFastFlow for printed circuit boards change in as little as 4 seconds
- Ultra thorough inspection of single or double-sided electronic assemblies
- System can be used as a 3D AXI system or 3D AXI/3D AOI combination
- Three different flat panel detector sizes for scalable throughput
- Versatile and adaptable inspection depth
- Additional vertical slices for optimum analyses and dependable verification
- Viscom Quality Uplink: Effective networking and process optimization
- Comprehensive IPC-compliant AXI inspection library
- High-quality 3D AXI volume calculation with planar CT
- Highest in-line AXI resolution for the best defect coverage and detection
Viscom-Plus
- Maximum inspection program optimization through integrated verification
- Global libraries, global calibration: Transferability to all systems
- Simple operation and inspection program generation with vVision/EasyPro
- Traceability, SPC, verification, off-line programming and much more
- Full support for lead-free technology
- Customer-specific and customizable software adaptation
- User interface available in multiple languages
- Complete statistical process analysis
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- Over 20 years of AXI experience included
Options
- Freely configurable interfaces to connect various modules
- Communication with MES systems
- Control of label printers and bad board markers
- Intelligent FIFO buffer control
- Preparation, filing, and printing of defect logs
- Flexible single and multi-line use of verification and repair stations
- Management monitoring through Viscom SPC
- Automated grayscale value calibration for constant inspection results
- User-friendly real image display for better verification (AOI)
- Selective X-ray inspection for process optimization (AXI OnDemand)