CVP-300 is automated laminator system which consists of diaphragm laminator(for 1st stage) and flattening press(for 2nd stage) With its high flattening capability, it is suitable for build-up and solder resist lamination process.

Equipment Structure:

  • Carrier Film Conveyance System(Film Forwarder/ Film Rewinder)
  • Diaphragm Lamination Chamber(1st) + Hydraulic Press Unit(2nd)

Lamination Method: Diaphragm

Footprint: (L) 4135mm x (w)3180mm x (h)1935mm

Acceptable Worksize MAX510 x 610(mm)


  • Compressed air(0.5~0.6MPa)
  • Forced Exhaust
  • 3-Phase AC 220V
  • Cooling Water for Vacuum Pump: 2~3L/Min

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