In-Line Plasma Cleaner


  • In-line cleaning process
  • Advanced plasma electrode design
  • Advanced flow pattern design
  • High-speed plasma cleaning: 30~90 seconds/cycle, including loading/unloading, plasma treatment
  • Low temperature plasma cleaning
  • Chamber capability: 2~4 strips of substrates or lead-frames in one cycle
  • Low gas flow rate
  • Operation mode: manual or auto mode
  • High automation and operation friendly design

Excellent Performance

  • Apply to in-line process
  • Multiple processing gases (Ar, N2, O2, H2, mixed gas, etc.) capable of achieving the best surface cleaning and treatment effects
  • Physical, chemical or physical/ chemical mode cleaning method
  • Very high cleaning efficiency
  • Extremely high cleaning uniformity
  • Very little gas consumption


  • Apply to process before wire bonding and molding in IC packaging or LED packaging industry
  • PBGA, Window-BGA, Mini-BGA, Micro-BGA, TFBGA (Film-BGA), LFBGA, VBGA (EBGA), Pin BGA, CSP, Flip-chip, TCP, PCB, COB and etc.
  • Cu L/F, Ag-Plating L/F, Fe L/F and etc.

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