In-Line Plasma Cleaner
Manufacturer
NEMS Tech.NEMST-2002IL(T)
- In-line cleaning process
- Advanced plasma electrode design
- Advanced flow pattern design
- High-speed plasma cleaning: 30~90 seconds/cycle, including loading/unloading, plasma treatment
- Low temperature plasma cleaning
- Chamber capability: 2~4 strips of substrates or lead-frames in one cycle
- Low gas flow rate
- Operation mode: manual or auto mode
- High automation and operation friendly design
Excellent Performance
- Apply to in-line process
- Multiple processing gases (Ar, N2, O2, H2, mixed gas, etc.) capable of achieving the best surface cleaning and treatment effects
- Physical, chemical or physical/ chemical mode cleaning method
- Very high cleaning efficiency
- Extremely high cleaning uniformity
- Very little gas consumption
Applications
- Apply to process before wire bonding and molding in IC packaging or LED packaging industry
- PBGA, Window-BGA, Mini-BGA, Micro-BGA, TFBGA (Film-BGA), LFBGA, VBGA (EBGA), Pin BGA, CSP, Flip-chip, TCP, PCB, COB and etc.
- Cu L/F, Ag-Plating L/F, Fe L/F and etc.